A mounting assembly with wire-leaded electronic power components for an inverter of an electric compressor of a climate control system includes a support frame structure with a bottom forming an upper side and an underside, and a multiplicity of passages from the upper side to the underside for securement elements for securing the support frame structure on a motor housing. On the underside of the bottom a hollow receiving volume is implemented. A leaded power module or power semiconductor is embedded. In each hollow receiving volume is a contact region for localized contact in places of the hollow receiving volume with an upwardly facing surface of power semiconductor or power module. The opposite, downwardly facing surface of the semiconductor or the power module forms a portion of the lower outer surface area of the mounting assembly. An assembly of the mounting assembly with a compressor motor housing is also provided.