Invention Application
- Patent Title: FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES
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Application No.: US16354049Application Date: 2019-03-14
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Publication No.: US20190214323A1Publication Date: 2019-07-11
- Inventor: Ya-Yu HSIEH , Hong-Ping LIN , Dao-Long CHEN , Ping-Feng YANG , Meng-Kai SHIH
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08G59/42 ; C08K5/5435 ; C08K5/544 ; C08K3/04 ; C08K3/36 ; H01L23/00 ; C09D163/00
Abstract:
A semiconductor package includes a filler composition, wherein the filler composition includes particles each including both carbon and silica, wherein the filler composition is substantially devoid of alumina or silicon carbide, and the filler composition has a weight ratio of carbon to silica of at least greater than 1.0.
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