Invention Application
- Patent Title: METHOD AND APPARATUS TO MONITOR A PROCESS APPARATUS
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Application No.: US16328319Application Date: 2017-08-14
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Publication No.: US20190214318A1Publication Date: 2019-07-11
- Inventor: Mark John MASLOW , Johannes Catharinus Hubertus MULKENS , Peter TEN BERGE , Franciscus VAN DE MAST , Jan-Willem GEMMINK , Liesbeth REIJNEN
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Priority: EP16187478.9 20160906
- International Application: PCT/EP2017/070586 WO 20170814
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G03F7/36 ; G03F7/20 ; H01L21/311 ; H01L21/67
Abstract:
A substrate, including a substrate layer; and an etchable layer on the substrate layer, the etchable layer including a patterned region thereon or therein and including a blank region of sufficient size to enable a bulk etch rate of an etch tool for etching the blank region to be determined.
Information query
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