Invention Application
- Patent Title: LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND WIRING SUBSTRATE
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Application No.: US16222224Application Date: 2018-12-17
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Publication No.: US20190184703A1Publication Date: 2019-06-20
- Inventor: Daisuke YAMADA , Eiju HIRAI , Motoki TAKABE , Yoichiro KONDO
- Applicant: Seiko Epson Corporation
- Priority: JP2017-244255 20171220
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejecting head includes a driving circuit configured to output a driving pulse; and a wiring substrate including a base body portion disposed between a flow path formation portion and the driving circuit, and a signal wiring formed on the base body portion and configured to transmit a driving signal for use in generation of the driving pulse by the driving circuit to the driving circuit from an input terminal. The signal wiring includes a first portion overlapping, in a plan view, at least one coupling terminal included in the driving circuit and coupled to the signal wiring, and a second portion located on the side of the input terminal when seen from the first portion, and the total number of wirings constituting the second portion is larger than the total number of wirings constituting the first portion.
Public/Granted literature
- US10814628B2 Liquid ejecting head, liquid ejecting apparatus, and wiring substrate Public/Granted day:2020-10-27
Information query
IPC分类: