Invention Application
- Patent Title: GAS FLOW FOR CONDENSATION REDUCTION WITH A SUBSTRATE PROCESSING CHUCK
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Application No.: US16213594Application Date: 2018-12-07
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Publication No.: US20190115240A1Publication Date: 2019-04-18
- Inventor: Hung Sang Kim , Michael D. Willwerth
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; C23C16/458 ; H01J37/32
Abstract:
A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.
Public/Granted literature
- US10770329B2 Gas flow for condensation reduction with a substrate processing chuck Public/Granted day:2020-09-08
Information query
IPC分类:
