- 专利标题: FinFet Device and Method of Forming the Same
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申请号: US15907633申请日: 2018-02-28
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公开(公告)号: US20190103477A1公开(公告)日: 2019-04-04
- 发明人: Chung-Ting Ko , Bo-Cyuan Lu , Jr-Hung Li , Chi On Chui
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/308 ; H01L21/762
摘要:
A FinFET device and a method of forming the same are provided. A method includes forming a fin extending above an isolation region. A sacrificial gate is formed over the fin. A first dielectric material is selectively deposited on sidewalls of the sacrificial gate to form spacers on the sidewalls of the sacrificial gate. The fin is patterned using the sacrificial gate and the spacers as a combined mask to form a recess in the fin. An epitaxial source/drain region is formed in the recess.
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