- 专利标题: PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE, AND PATTERN FORMING METHOD
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申请号: US16136717申请日: 2018-09-20
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公开(公告)号: US20190094692A1公开(公告)日: 2019-03-28
- 发明人: Tatsuro ISHIKAWA , Naozumi MATSUMOTO , Dai SHIOTA
- 申请人: TOKYO OHKA KOGYO CO., LTD.
- 优先权: JP2017-185324 20170926; JP2017-249820 20171226
- 主分类号: G03F7/031
- IPC分类号: G03F7/031 ; G03F7/032 ; G03F7/075 ; G03F7/016 ; G03F7/16 ; G03F7/26 ; C08K3/04 ; C08K5/00 ; C09B3/14 ; C09B23/01
摘要:
A photosensitive resin composition which gives a cured film having high light shielding properties and enables stable curing by baking at low temperature, a cured film obtained by curing the composition, a display device provided with the cured film, and a pattern forming method using the composition. A light shielding film-forming process which does not impart thermal damage to a light-emitting element with respect to a substrate provided with a light-emitting element. In a photosensitive resin composition including a binder resin, a photopolymerizable compound, a photopolymerization initiator, a coloring agent, and a thermosetting compound, a carbon black and/or an inorganic black pigment, and an organic pigment are used in combination as the coloring agent, and a photosensitive resin composition in which T2/T1 is 0.80 or more is used.
公开/授权文献
- US1240199A Hoe. 公开/授权日:1917-09-18
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