Invention Application
- Patent Title: A MEMBRANE FOR EUV LITHOGRAPHY
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Application No.: US16060635Application Date: 2016-12-02
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Publication No.: US20190011828A1Publication Date: 2019-01-10
- Inventor: Pieter-Jan VAN ZWOL , Dennis DE GRAAF , Paul JANSSEN , Mária PÉTER , Marcus Adrianus VAN DE KERKHOF , Willem Joan VAN DER ZANDE , David Ferdinand VLES , Willem-Pieter VOORTHUIJZEN
- Applicant: ASML NETHERLANDS B.V
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Priority: EP15199845.7 20151214; EP16163962.0 20160406
- International Application: PCT/EP2016/079594 WO 20161202
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/62 ; G03F7/20
Abstract:
A membrane for EUV lithography, the membrane having a thickness of no more than 200 nm and including a stack having: at least one silicon layer; and at least one silicon compound layer made of a compound of silicon and an element selected from the group consisting of boron, phosphorous, bromine.
Public/Granted literature
- US11320731B2 Membrane for EUV lithography Public/Granted day:2022-05-03
Information query
