Invention Application
- Patent Title: SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US16106101Application Date: 2018-08-21
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Publication No.: US20180355513A1Publication Date: 2018-12-13
- Inventor: Kyoko OKITA
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2014-216483 20141023
- Main IPC: C30B33/10
- IPC: C30B33/10 ; H01L21/02 ; H01L29/16 ; H01L21/67 ; B24B37/04 ; C30B29/36 ; H01L21/306 ; H01L21/04

Abstract:
A method for manufacturing a silicon carbide substrate includes steps of preparing a silicon carbide substrate having a main surface, polishing the main surface of the silicon carbide substrate using a polishing agent containing a metal catalyst, and cleaning the silicon carbide substrate after the step of polishing. The step of cleaning includes a step of cleaning the silicon carbide substrate with aqua regia.
Public/Granted literature
- US10704163B2 Silicon carbide substrate and method for manufacturing the same Public/Granted day:2020-07-07
Information query
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