- 专利标题： RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR DATA SIGNAL CONTACTS OF PACKAGE DEVICES; VERTICAL GROUND SHIELDING STRUCTURES AND SHIELD FENCING OF VERTICAL DATA SIGNAL INTERCONNECTS OF PACKAGE DEVICES; AND GROUND SHIELDING FOR ELECTRO OPTICAL MODULE CONNECTOR DATA SIGNAL CONTACTS AND CONTACT PINS OF PACKAGE DEVICES
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申请号： US15774257申请日： 2015-12-26
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公开(公告)号： US20180331043A1公开(公告)日： 2018-11-15
- 发明人: Yu Amos ZHANG , Zhiguo QIAN , Kemal AYGUN , Yidnekachew S. MEKONNEN , Gregorio R. MURTAGIAN , Sanka GANESAN , Eduard ROYTMAN , Jeff C. MORRISS
- 申请人： Intel Corporation
- 国际申请： PCT/US15/00388 WO 20151226
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/66 ; H01L23/552
摘要：
A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical “signal” interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia). The ground shielding for the electro-optical module may include patterns of ground isolation shielding attachments and contacts.
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