Invention Application
- Patent Title: THERMALLY CONDUCTIVE COMPOSITION VIA COATING ON PLASTICS
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Application No.: US15770986Application Date: 2016-10-17
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Publication No.: US20180312650A1Publication Date: 2018-11-01
- Inventor: Yaqin ZHANG , Ming GU , Feng JIANG , Mingcheng GUO
- Applicant: SABIC Global Technologies B.V.
- International Application: PCT/IB2016/056226 WO 20161017
- Main IPC: C08J7/04
- IPC: C08J7/04 ; C09D5/24 ; C09D5/32

Abstract:
An article may comprise a substrate formed from a thermoplastic or thermoset; and a thermal conductive or heat absorptive coating disposed adjacent the substrate to form a composite stack, wherein the composite stack is characterized by an increase of through plane thermal conductivity of at least 2 W/m*K, when compared to the substrate without the coating.
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