A method of imparting electrical conductivity on an interlayer material is disclosed. In one non-limiting example the method includes forming the interlayer material from at least one layer of fabric of thermoplastic fibers. The method further includes, treating the surface of the interlayer material using an atmospheric-pressure plasma such that the surface of the interlayer material undergoes a surface activation. Additionally, the method includes depositing a layer of conductive material on the surface of the interlayer material such that the conductive material increases a conductivity of the interlayer material.