Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15184828Application Date: 2016-06-16
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Publication No.: US20170365515A1Publication Date: 2017-12-21
- Inventor: Chin-Cheng KUO , Pao-Nan LEE , Chih-Pin HUNG , Ying-Te OU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/48 ; H01L23/00 ; H01L23/522 ; H01L23/528
Abstract:
The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.
Public/Granted literature
- US10236208B2 Semiconductor package structure and method of manufacturing the same Public/Granted day:2019-03-19
Information query
IPC分类:
