Invention Application
- Patent Title: METHOD & APPARATUS TO PREVENT DEPOSITION RATE/THICKNESS DRIFT, REDUCE PARTICLE DEFECTS & INCREASE REMOTE PLASMA SYSTEM LIFETIME
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Application No.: US15494186Application Date: 2017-04-21
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Publication No.: US20170306493A1Publication Date: 2017-10-26
- Inventor: Daemian RAJ , Ying MA , DongQing LI , Jay D. PINSON, II
- Applicant: Applied Materials, Inc.
- Main IPC: C23C16/50
- IPC: C23C16/50 ; H01J37/32 ; C23C16/455 ; C23C16/44 ; H01L21/02 ; B08B7/00
Abstract:
A method and apparatus for a deposition chamber is provided and includes a twin chamber that includes a first remote plasma system coupled and dedicated to a first processing region, a second remote plasma system coupled and dedicated to a second processing region, and a third remote plasma system shared by the first processing region and the second processing region.
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