- 专利标题： Chemical Mechanical Polishing Apparatus and Method
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申请号： US15136706申请日： 2016-04-22
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公开(公告)号： US20170304990A1公开(公告)日： 2017-10-26
- 发明人: Ting-Kui Chang , Fu-Ming Huang , Liang-Guang Chen , Chun-Chieh Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： B24B37/20
- IPC分类号： B24B37/20 ; B24B37/005
摘要：
A polisher head of a polishing apparatus includes a membrane and a first local pressure nodule and a second local pressure nodule physically contacting the membrane. The first local pressure nodule is configured to apply a first local force to the membrane and the second local pressure nodule is configured to apply a second local force to the membrane. The first local pressure nodule and the second local pressure nodule are independently controllable.
公开/授权文献
- US09962805B2 Chemical mechanical polishing apparatus and method 公开/授权日：2018-05-08
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