Invention Application
- Patent Title: WAFER LEVEL PACKAGING OF MEMS
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Application No.: US15463246Application Date: 2017-03-20
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Publication No.: US20170217759A1Publication Date: 2017-08-03
- Inventor: Stuart M. Jacobsen , Wei-Yan Shih
- Applicant: Texas Instruments Incorporated
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00

Abstract:
A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
Public/Granted literature
- US12091311B2 Wafer level packaging of MEMS Public/Granted day:2024-09-17
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