Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
-
Application No.: US15333693Application Date: 2016-10-25
-
Publication No.: US20170178985A1Publication Date: 2017-06-22
- Inventor: Yoshiaki SATO , Yosuke KATSURA
- Applicant: Renesas Electronics Corporation
- Priority: JP2015-245884 20151217
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L21/48 ; H01L23/498 ; H01L23/00 ; H01L25/00 ; H01L23/10
Abstract:
A semiconductor device includes a semiconductor chip and a package structure mounted on a wiring substrate, and a lid for covering the semiconductor chip, which is fixed to the surface of the wiring substrate, without overlapping with the package structure in plan view. The lid includes an upper surface portion overlapping with the semiconductor chip, a flange portion fixed to the surface of the wiring substrate, and a slant portion for jointing the upper surface portion and the flange portion. Then, a distance from the surface of the wiring substrate to the top surface of the upper surface portion is larger than a distance from the surface of the wiring substrate to the top surface of the flange portion.
Information query
IPC分类:
