Invention Application
- Patent Title: COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES
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Application No.: US14902183Application Date: 2014-07-02
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Publication No.: US20170125370A1Publication Date: 2017-05-04
- Inventor: Sean S. Cahill , Eric A. Sanjuan
- Applicant: ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
- International Application: PCT/EP2014/001821 WO 20140702
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/66
Abstract:
A bond wire having a metal core, a dielectric layer, and a ground connectable metallization, wherein the bond wire has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one bond wire according to the invention.
Public/Granted literature
- US09997489B2 Coated bond wires for die packages and methods of manufacturing said coated bond wires Public/Granted day:2018-06-12
Information query
IPC分类:
