- 专利标题: METHOD FOR REMOVING WORK-AFFECTED LAYER ON SiC SEED CRYSTAL, SiC SEED CRYSTAL, AND SiC SUBSTRATE MANUFACTURING METHOD
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申请号: US15300597申请日: 2015-03-10
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公开(公告)号: US20170114475A1公开(公告)日: 2017-04-27
- 发明人: Norihito Yabuki , Satoshi Torimi , Satoru Nogami
- 申请人: TOYO TANSO CO., LTD.
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: TOYO TANSO CO., LTD.
- 当前专利权人: TOYO TANSO CO., LTD.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 优先权: JP2014-074742 20140331
- 国际申请: PCT/JP2015/001302 WO 20150310
- 主分类号: C30B19/12
- IPC分类号: C30B19/12 ; C30B29/36 ; C30B19/04
摘要:
Provided is a method in which the rate of growth is lowered even when a cut SiC seed crystal is used in performing MSE process. A SiC seed crystal that is used as a seed crystal in metastable solvent epitaxy process (MSE process) is heated under Si atmosphere and the surface of the SiC seed crystal is etched to remove a work-affected layer that was formed by cutting. Work-affected layers generated on SiC seed crystals are known to inhibit growth during MSE process, and therefore removing the work-affected layers can prevent lowering of the rate of growth.
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