Invention Application
- Patent Title: METHOD OF USING A WAFER CASSETTE TO CHARGE AN ELECTROSTATIC CARRIER
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Application No.: US15386032Application Date: 2016-12-21
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Publication No.: US20170103910A1Publication Date: 2017-04-13
- Inventor: Wen-Chih Chiou , Yung-Chi Lin , Yu-Liang Lin , Hung-Jung Tu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/673
Abstract:
A method comprising placing a wafer assembly in a wafer cassette, wherein the wafer assembly includes a wafer and an electrostatic carrier attached to the wafer. In addition, the electrostatic carrier is charged through the wafer cassette, the wafer cassette is transported to a next process stage, and the wafer assembly is removed from the wafer cassette.
Public/Granted literature
- US10068789B2 Method of using a wafer cassette to charge an electrostatic carrier Public/Granted day:2018-09-04
Information query
IPC分类:
