- 专利标题: STACKED FAN-OUT PACKAGE STRUCTURE
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申请号: US15218379申请日: 2016-07-25
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公开(公告)号: US20170098629A1公开(公告)日: 2017-04-06
- 发明人: Nai-Wei LIU , Tzu-Hung LIN , I-Hsuan PENG , Ching-Wen HSIAO , Wei-Che HUANG
- 申请人: MediaTek Inc.
- 主分类号: H01L25/065
- IPC分类号: H01L25/065 ; H01L23/00 ; H01L25/00
摘要:
A semiconductor package structure is provided. The structure includes a first semiconductor die having a first surface and a second surface opposite thereto. A first molding compound surrounds the first semiconductor die. A first redistribution layer (RDL) structure is disposed on the second surface of the first semiconductor die and laterally extends on the first molding compound. A second semiconductor die is disposed on the first RDL structure and has a first surface and a second surface opposite thereto. A second molding compound surrounds the second semiconductor die. A first protective layer covers a sidewall of the first RDL structure and a sidewall of the first molding compound.
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