发明申请
- 专利标题: POWER AMPLIFIER MODULE
- 专利标题(中): 功率放大器模块
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申请号: US15251031申请日: 2016-08-30
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公开(公告)号: US20170047894A1公开(公告)日: 2017-02-16
- 发明人: Kiichiro Takenaka , Masahiro Ito , Masakazu Hori , Mitsuo Ariie , Hayato Nakamura , Satoshi Arayashiki , Hidetoshi Matsumoto , Tsuyoshi Sato , Satoshi Tanaka
- 申请人: Murata Manufacturing Co., Ltd.
- 优先权: JP2013-159360 20130731; JP2014-033147 20140224
- 主分类号: H03F1/02
- IPC分类号: H03F1/02 ; H03F1/32 ; H03G3/00 ; H03F3/21
摘要:
Improvement in linearity is achieved at low costs in a power amplifier module employing an envelope tracking system. The power amplifier module includes a first power amplifier circuit that amplifies a radio frequency signal and that outputs a first amplified signal, a second power amplifier circuit that amplifies the first amplified signal on the basis of a source voltage varying depending on amplitude of the radio frequency signal and that outputs a second amplified signal, and a matching circuit that includes first and second capacitors connected in series between the first and second power amplifier circuit and an inductor connected between a node between the first and second capacitors and a ground and that decreases a gain of the first power amplifier circuit as the source voltage of the second power amplifier circuit increases.
公开/授权文献
- US10020779B2 Power amplifier module 公开/授权日:2018-07-10
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