Invention Application
US20170025332A1 Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chips and Components
审中-公开
具有垂直堆叠芯片和组件的封装电子系统的易碎引线框架
- Patent Title: Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chips and Components
- Patent Title (中): 具有垂直堆叠芯片和组件的封装电子系统的易碎引线框架
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Application No.: US15287561Application Date: 2016-10-06
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Publication No.: US20170025332A1Publication Date: 2017-01-26
- Inventor: Lee Han Meng@ Eugene Lee , Anis Fauzi Bin Abdul Aziz , Sueann Lim Wei Fen
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L51/56 ; H01L21/48
Abstract:
A leadframe (100) for electronic systems comprising a first sub-leadframe (110) connected by links (150) to a second sub-leadframe (120), the first and second sub-leadframe connected by tiebars (111, 121) to a frame (130); and each link having a neck (151) suitable for bending the link, the necks arrayed in a line (170) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.
Public/Granted literature
- US3114572A Folding rocking chair Public/Granted day:1963-12-17
Information query
IPC分类:
