Invention Application
- Patent Title: SEMICONDUCTOR WIRE BONDING AND METHOD
- Patent Title (中): 半导体接线和方法
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Application No.: US14749219Application Date: 2015-06-24
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Publication No.: US20160379953A1Publication Date: 2016-12-29
- Inventor: Patrick Francis Thompson , Jeffrey Alan West , Thomas D. Bonifield , Fu-Kang Hsu , Ching-Lun Hsia
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Circuitry is disclosed that includes a first conductive portion of a first die and a first conductive pillar electrically and physically connected to the first conductive portion. The first conductive pillar includes a first conductive pillar surface. A first bond connects the first conductive pillar surface to a first end of a bond wire.
Information query
IPC分类:
