Invention Application
- Patent Title: INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE
- Patent Title (中): 包装式包装结构的插销器
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Application No.: US14733201Application Date: 2015-06-08
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Publication No.: US20160358899A1Publication Date: 2016-12-08
- Inventor: Jae Sik LEE , Kyu-Pyung HWANG , Hong Bok WE
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/065 ; H01L21/48 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/50
Abstract:
A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the second die. The interposer includes copper-filled vias formed within a mold.
Public/Granted literature
- US09613942B2 Interposer for a package-on-package structure Public/Granted day:2017-04-04
Information query
IPC分类:
