Invention Application
- Patent Title: PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 印刷电路板，半导体封装及其制造方法
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Application No.: US15016136Application Date: 2016-02-04
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Publication No.: US20160353572A1Publication Date: 2016-12-01
- Inventor: Jae Hyun LIM , Jong Man KIM , Jin Su KIM , Heung Woo PARK , Sun Ho KIM , Jung Gon CHOI
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0073013 20150526
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/46 ; H05K1/02
Abstract:
A printed circuit board, a semiconductor package, and a method of producing the same are provided. The printed circuit board (PCB) includes an insulating layer and a circuit layer including metal pads exposed on a side surface and a lower surface of the insulating layer.
Information query
