Invention Application
- Patent Title: FLEXIBLE DEVICE HAVING FLEXIBLE INTERCONNECT LAYER USING TWO-DIMENSIONAL MATERIALS
- Patent Title (中): 具有两维材料的柔性互连层的柔性器件
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Application No.: US14932439Application Date: 2015-11-04
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Publication No.: US20160343670A1Publication Date: 2016-11-24
- Inventor: Jaeho LEE , Taeho Kim , Seongjun Park
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0071140 20150521
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/538 ; H01L23/48 ; H01L23/528

Abstract:
A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer includes a two-dimensional (2D) material and a conductive polymer to have high electric conductivity and flexibility. The flexible device includes a flexible interconnect layer of one or more layers, and in this case, includes a low-dielectric constant dielectric layer between the respective layers.
Public/Granted literature
- US10134676B2 Flexible device having flexible interconnect layer using two-dimensional materials Public/Granted day:2018-11-20
Information query
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