Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 半导体封装结构及其制造方法
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Application No.: US14685529Application Date: 2015-04-13
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Publication No.: US20160300782A1Publication Date: 2016-10-13
- Inventor: Tang-Yuan CHEN , Chin-Li KAO , Kuo-Hua CHEN , Ming-Hung CHEN , Dao-Long CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L23/31
Abstract:
The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.
Public/Granted literature
- US09589871B2 Semiconductor package structure and method for manufacturing the same Public/Granted day:2017-03-07
Information query
IPC分类:
