发明申请
US20160271651A1 Modular assembly for multidimensional transducer arrays 审中-公开
用于多维传感器阵列的模块化组件

Modular assembly for multidimensional transducer arrays
摘要:
An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.
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