发明申请
- 专利标题: Modular assembly for multidimensional transducer arrays
- 专利标题(中): 用于多维传感器阵列的模块化组件
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申请号: US14660475申请日: 2015-03-17
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公开(公告)号: US20160271651A1公开(公告)日: 2016-09-22
- 发明人: David A. Petersen , Terry Simpson , Walter Petersen , Jerry Hopple , Xuan-ming Lu
- 申请人: Siemens Medical Solutions USA, Inc.
- 主分类号: B06B1/06
- IPC分类号: B06B1/06

摘要:
An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.
公开/授权文献
- US10137477B2 Modular assembly for multidimensional transducer arrays 公开/授权日:2018-11-27
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