Invention Application
- Patent Title: METHODS AND APPARATUS PROVIDING THERMAL ISOLATION OF PHOTONIC DEVICES
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Application No.: US15056845Application Date: 2016-02-29
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Publication No.: US20160181495A1Publication Date: 2016-06-23
- Inventor: Roy Meade , Gurtej Sandhu
- Applicant: Micron Technology, Inc.
- Main IPC: H01L33/64
- IPC: H01L33/64 ; G02B6/12
Abstract:
Described embodiments include photonic integrated circuits and systems with photonic devices, including thermal isolation regions for the photonic devices. Methods of fabricating such circuits and systems are also described.
Public/Granted literature
- US10090451B2 Methods and apparatus providing thermal isolation of photonic devices Public/Granted day:2018-10-02
Information query
IPC分类:
