Invention Application
US20160132064A1 Load Transient , Reduced Bond Wires for Circuits Supplying Large Currents
有权
负载瞬态,减少提供大电流的电路的接合线
- Patent Title: Load Transient , Reduced Bond Wires for Circuits Supplying Large Currents
- Patent Title (中): 负载瞬态,减少提供大电流的电路的接合线
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Application No.: US14996705Application Date: 2016-01-15
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Publication No.: US20160132064A1Publication Date: 2016-05-12
- Inventor: Ambreesh Bhattad , Ludmil Nikolov
- Applicant: Dialog Semiconductor GmbH
- Main IPC: G05F1/575
- IPC: G05F1/575

Abstract:
Circuits and methods to improve dynamic load transient performance of circuits supplying high current and having parasitic resistances are disclosed. These circuits comprise e.g. LDOs, amplifiers or buffers. The circuits and methods are characterized by including parasitic resistances, caused by bond wires, metallization of pass devices, and substrate routings, in a loop for fast transient response. Furthermore the circuits comprise a stabilization circuit within said loop and a separate pad for said loop.
Public/Granted literature
- US09454170B2 Load transient, reduced bond wires for circuits supplying large currents Public/Granted day:2016-09-27
Information query
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