Invention Application
- Patent Title: OBJECT MODELING METHOD AND APPARATUS
- Patent Title (中): 对象建模方法和装置
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Application No.: US14825755Application Date: 2015-08-13
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Publication No.: US20160063140A1Publication Date: 2016-03-03
- Inventor: Nahyup KANG , Jiyeon KIM , Hyong-euk LEE , Hwiryong JUNG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0111467 20140826; KR10-2015-0059496 20150428
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F17/10

Abstract:
Provided is a method and apparatus for modeling objects that may include detecting an adjacent area that shares modeled particles of a first object and modeled particles of a second object, calculating an action force between the first object and the second object in the adjacent area based on information stored for grid points of a grid defined with respect to the adjacent area, and modelling the first object and the second object based on the calculated action force.
Public/Granted literature
- US09953109B2 Object modeling method and apparatus Public/Granted day:2018-04-24
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