发明申请
US20160043480A1 JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART
审中-公开
接合方法，接头结构，电子器件，制造电子器件和电子部件的方法
- 专利标题： JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART
- 专利标题（中）： 接合方法，接头结构，电子器件，制造电子器件和电子部件的方法
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申请号： US14918648申请日： 2015-10-21
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公开(公告)号： US20160043480A1公开(公告)日： 2016-02-11
- 发明人: Kosuke Nakano , Hidekiyo Takaoka
- 申请人： Murata Manufacturing Co., Ltd.
- 优先权： JP2010-287782 20101224; JP2011-159922 20110721
- 主分类号： H01R4/02
- IPC分类号： H01R4/02 ; H01R4/58
摘要：
A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.
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