Invention Application
- Patent Title: SELECTIVE PLATING WITHOUT PHOTORESIST
- Patent Title (中): 选择性放置没有光电子
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Application No.: US14822928Application Date: 2015-08-11
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Publication No.: US20150348910A1Publication Date: 2015-12-03
- Inventor: Charles L. Arvin , Harry D. Cox , Brian M. Erwin , John J. Garant , Ekta Misra , Nicholas A. Polomoff , Jennifer D. Schuler
- Applicant: International Business Machines Corporation
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/528

Abstract:
A structure including a stack of conformal layers on top of a dielectric layer and within an opening in the dielectric layer, the stack of layers including a first layer, a second layer, a third layer, and a fourth layer, each formed successively one on top of another with the first layer being in direct contact with the dielectric layer, and a conductive feature located directly on top of the fourth layer within the opening.
Information query
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