Invention Application
US20150348910A1 SELECTIVE PLATING WITHOUT PHOTORESIST 审中-公开
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SELECTIVE PLATING WITHOUT PHOTORESIST
Abstract:
A structure including a stack of conformal layers on top of a dielectric layer and within an opening in the dielectric layer, the stack of layers including a first layer, a second layer, a third layer, and a fourth layer, each formed successively one on top of another with the first layer being in direct contact with the dielectric layer, and a conductive feature located directly on top of the fourth layer within the opening.
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