A method of making a multilayer circuit board includes: forming and exposing a first polyimide photoresist layer; forming holes in the first polyimide photoresist layer; forming a second metal layer on the first polyimide photoresist layer; forming a first photoresist mask layer on the second metal layer; patterning the first photoresist mask layer and the second metal layer; forming a second polyimide photoresist layer on the patterned second metal layer; exposing the second polyimide photoresist layer; forming a hole in the second polyimide photoresist layer; forming a third metal layer on the second polyimide photoresist layer; and forming and patterning a second photoresist mask layer on the third metal layer.