A method of manufacturing a solid electrolytic capacitor chip, which includes mounting a solid electrolytic capacitor element on the front surface side of a cathode lead of a lead frame serving as a cathode terminal; electrically connecting an anode and a cathode of the solid electrolytic capacitor element respectively to an anode terminal and the cathode terminal of the lead frame; and injecting an exterior resin from a resin injection port of a mold by transfer molding so as to seal the solid electrolytic capacitor element with the exterior resin. The resin injection port is located such that the exterior resin injected from the injection port branches and flows toward both the front surface side and the rear surface side and of the lead frame.