Invention Application
US20150187731A1 LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
审中-公开
低成本连接器，用于高速，高密度信号传送
- Patent Title: LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Patent Title (中): 低成本连接器，用于高速，高密度信号传送
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Application No.: US14141342Application Date: 2013-12-26
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Publication No.: US20150187731A1Publication Date: 2015-07-02
- Inventor: Dong Wook KIM , Kyu-Pyung HWANG , Chin-Kwan KIM , Young Kyu SONG , Hong Bok WE
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/00
Abstract:
A high-speed, high-density Input/Output bridge couples dies on a substrate to each other using a flexible connector that is attached to the substrate using solder balls disposed in openings in the substrate. Thus, the bulky, male-to-female connectors and/or silicon bridges are eliminated while still permitting dies disposed on the substrate to be coupled together.
Information query
IPC分类:
