Invention Application
- Patent Title: BUMP STRUCTURE HAVING A SINGLE SIDE RECESS
- Patent Title (中): 单层结构的BUMP结构
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Application No.: US14507189Application Date: 2014-10-06
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Publication No.: US20150084186A1Publication Date: 2015-03-26
- Inventor: Chih-Horng CHANG , Tin-Hao KUO , Chen-Shien CHEN , Yen-Liang LIN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A bump structure includes a first end, and a second end opposite the first end. The bump structure further includes a first side connected between the first end and the second end. The bump structure further includes a second side opposite the first side. The second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.
Public/Granted literature
- US09105533B2 Bump structure having a single side recess Public/Granted day:2015-08-11
Information query
IPC分类:
