发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US14463998申请日: 2014-08-20
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公开(公告)号: US20150069469A1公开(公告)日: 2015-03-12
- 发明人: Hisashi SAITO
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2013-187764 20130910
- 主分类号: H01L29/20
- IPC分类号: H01L29/20 ; H01L29/778 ; H01L29/423 ; H01L29/205
摘要:
According to one embodiment, a semiconductor device includes a nitride semiconductor layer, a first electrode provided on the layer, a second electrode provided on the layer, a insulating film provided on the layer, a first control electrode provided on the film, and a conductor provided on the film. The first control electrode includes a first edge, and a second edge. The first edge is provided between the second edge and the first electrode. The conductor includes a first portion and a third edge positioned between the first portion and the first electrode. An electric field strength at a first region is substantially equal to an electric field strength at a second region. The first region overlaps the first edge when projected onto a plane perpendicular to a stacking direction. The second region overlaps the third edge when projected onto the plane.
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