发明申请
- 专利标题： DEVICE AND METHOD FOR BONDING SUBSTRATES
- 专利标题（中）： 用于粘结基板的装置和方法
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申请号： US14387380申请日： 2012-05-30
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公开(公告)号： US20150069115A1公开(公告)日： 2015-03-12
- 发明人: Bernhard Rebhan
- 申请人： Bernhard Rebhan
- 申请人地址： AT ST. FLORIAN AM INN
- 专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人： EV GROUP E. THALLNER GMBH
- 当前专利权人地址： AT ST. FLORIAN AM INN
- 国际申请： PCT/EP2012/060171 WO 20120530
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K20/14 ; B23K20/26 ; B23K20/24 ; B23K37/00 ; B23K31/02
摘要：
A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space,The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.
公开/授权文献
- US09443820B2 Device and method for bonding substrates 公开/授权日：2016-09-13
信息查询
IPC分类:
