Invention Application
- Patent Title: CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE
- Patent Title (中): 陶瓷电路板和电子设备
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Application No.: US14457429Application Date: 2014-08-12
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Publication No.: US20150049442A1Publication Date: 2015-02-19
- Inventor: Makoto TANI , Yoshihiro TANAKA , Takashi EBIGASE
- Applicant: NGK INSULATORS, LTD.
- Priority: JP2013-169261 20130816
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/03
Abstract:
A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.
Public/Granted literature
- US09439279B2 Ceramic circuit board and electronic device Public/Granted day:2016-09-06
Information query
