Invention Application
- Patent Title: ELECTRONIC DEVICE COMPRISING A SUBSTRATE BOARD EQUIPPED WITH A LOCAL REINFORCING OR BALANCING LAYER
- Patent Title (中): 包含配有本地增强或平衡层的基板的电子设备
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Application No.: US14444583Application Date: 2014-07-28
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Publication No.: US20150036309A1Publication Date: 2015-02-05
- Inventor: Jean-Michel Riviere , Karine Saxod
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Priority: FR1357515 20130730
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/30
Abstract:
A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.
Public/Granted literature
- US09420685B2 Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer Public/Granted day:2016-08-16
Information query
