发明申请
- 专利标题： NON-CONTACT SHEET RESISTANCE MEASUREMENT OF BARRIER AND/OR SEED LAYERS PRIOR TO ELECTROPLATING
- 专利标题（中）： 电镀前的屏障和/或种子层的非接触片电阻测量
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申请号： US14066005申请日： 2013-10-29
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公开(公告)号： US20140367265A1公开(公告)日： 2014-12-18
- 发明人: Abraham Ravid , Dmitry A. Dzilno , Todd J. Egan , Robert O. Miller
- 申请人： APPLIED MATERIALS, INC.
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： G01N27/20
- IPC分类号： G01N27/20 ; C25D21/12
摘要：
A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.
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