Invention Application
- Patent Title: ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE MANUFACTURING APPARATUS
- Patent Title (中): 电子设备，制造方法和电子设备制造设备
-
Application No.: US14452754Application Date: 2014-08-06
-
Publication No.: US20140342504A1Publication Date: 2014-11-20
- Inventor: Taiji SAKAI , Nobuhiro IMAIZUMI
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Priority: JP2012-009728 20120120; JP2012-149410 20120703
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G21K5/02 ; H01L21/3213 ; H01L21/268 ; H01L21/67
Abstract:
According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.
Public/Granted literature
- US09911642B2 Method of manufacturing an electronic device, and electronic device manufacturing apparatus Public/Granted day:2018-03-06
Information query
IPC分类:
