Invention Application
US20140341503A1 SEMICONDUCTOR SUBSTRATE FOR PHOTONIC AND ELECTRONIC STRUCTURES AND METHOD OF MANUFACTURE 有权
用于光电子和电子结构的半导体衬底及其制造方法

  • Patent Title: SEMICONDUCTOR SUBSTRATE FOR PHOTONIC AND ELECTRONIC STRUCTURES AND METHOD OF MANUFACTURE
  • Patent Title (中): 用于光电子和电子结构的半导体衬底及其制造方法
  • Application No.: US14446744
    Application Date: 2014-07-30
  • Publication No.: US20140341503A1
    Publication Date: 2014-11-20
  • Inventor: Roy MeadeGurtej Sandhu
  • Applicant: MICRON TECHNOLOGY, INC.
  • Main IPC: G02B6/122
  • IPC: G02B6/122
SEMICONDUCTOR SUBSTRATE FOR PHOTONIC AND ELECTRONIC STRUCTURES AND METHOD OF MANUFACTURE
Abstract:
A method of forming a substrate with isolation areas suitable for integration of electronic and photonic devices is provided. A common reticle and photolithographic technique is used to fabricate a mask defining openings for etching first and second trench isolation areas in a substrate, with the openings for the second trench isolation areas being wider than the openings for the first trench isolation areas. The first and second trench isolation areas are etched in the substrate through the mask. The second trench isolation areas are further etched to the deeper than the first trench isolation areas. The trench isolation areas are filled with oxide material. Electrical devices can be formed on the substrate and electrically isolated by the first trench isolation areas and photonic devices can be formed over the second trench isolation areas and be optically isolated from the substrate.
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