Invention Application
- Patent Title: PHOTONIC DEVICE STRUCTURE AND METHOD OF MANUFACTURE
- Patent Title (中): 光电器件结构及其制造方法
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Application No.: US13776836Application Date: 2013-02-26
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Publication No.: US20140241682A1Publication Date: 2014-08-28
- Inventor: Gurtej Sandhu , Roy Meade
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L21/308
- IPC: H01L21/308 ; G02B6/02
Abstract:
Disclosed method and apparatus embodiments provide a photonic device with optical isolation from a supporting substrate. A generally rectangular cavity in cross section is provided below an element of the photonic device and the element may be formed from a ledge of the supporting substrate which is over the cavity.
Public/Granted literature
- US09005458B2 Photonic device structure and method of manufacture Public/Granted day:2015-04-14
Information query
IPC分类:
