Invention Application
- Patent Title: LIGHT EMITTING ELEMENT AND LIGHT EMITTING ELEMENT PACKAGE
- Patent Title (中): 发光元件和发光元件包
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Application No.: US14159578Application Date: 2014-01-21
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Publication No.: US20140203318A1Publication Date: 2014-07-24
- Inventor: Nobuaki MATSUI , Seiji KAMIDA , Tadateru SHIBATA
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2013-008772 20130121
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/44

Abstract:
A light emitting element includes: a sapphire substrate having a front surface and a rear surface opposite the front surface; a first conductive type semiconductor layer stacked on the front surface of the sapphire substrate; a light emitting layer stacked on the first conductive type semiconductor layer; a second conductive type semiconductor layer stacked on the light emitting layer; a reflective layer which contains Ag and is disposed on the rear surface of the sapphire substrate, the reflective layer reflecting light from the sapphire substrate toward the front surface of the sapphire substrate; and an adhesive layer which is interposed between the sapphire substrate and the reflective layer and is made of ITO, the adhesive layer being adhered to the reflective layer.
Public/Granted literature
- US09799808B2 Light emitting element and light emitting element package Public/Granted day:2017-10-24
Information query
IPC分类: