发明申请
US20140134833A1 ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD 有权
离子植入装置和离子植入方法

  • 专利标题: ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD
  • 专利标题(中): 离子植入装置和离子植入方法
  • 申请号: US14077746
    申请日: 2013-11-12
  • 公开(公告)号: US20140134833A1
    公开(公告)日: 2014-05-15
  • 发明人: Mitsukuni TsukiharaMitsuaki Kabasawa
  • 申请人: SEN Corporation
  • 申请人地址: JP Tokyo
  • 专利权人: SEN CORPORATION
  • 当前专利权人: SEN CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2012-249662 20121113
  • 主分类号: H01L21/265
  • IPC分类号: H01L21/265
ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD
摘要:
An ion implantation apparatus includes a beamline device for transporting ions from an ion source to an implantation processing chamber. The implantation processing chamber includes a workpiece holder for mechanically scanning a workpiece with respect to a beam irradiation region. The beamline device may be operated under a first implantation setting configuration suitable for transport of a low energy/high current beam for high-dose implantation into the workpiece, or a second implantation setting configuration suitable for transport of a high energy/low current beam for low-dose implantation into the workpiece. A beam center trajectory being a reference in a beamline is equal from the ion source to the implantation processing chamber in the first implantation setting configuration and the second implantation setting configuration.
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