发明申请
- 专利标题： BONDING METHOD AND PRODUCTION METHOD
- 专利标题（中）： 结合方法和生产方法
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申请号： US14103050申请日： 2013-12-11
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公开(公告)号： US20140097232A1公开(公告)日： 2014-04-10
- 发明人: Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
- 申请人： Fujikura Ltd.
- 申请人地址： JP Tokyo
- 专利权人： FUJIKURA LTD.
- 当前专利权人： FUJIKURA LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-134549 20110616
- 主分类号： B23K1/00
- IPC分类号： B23K1/00
摘要：
A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S′) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.
公开/授权文献
- US2621766A Cutoff for fuel control of motor vehicles 公开/授权日：1952-12-16
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