发明申请
- 专利标题： Ladder Bump Structures and Methods of Making Same
- 专利标题（中）： 梯形凸块结构及其制作方法
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申请号： US13734811申请日： 2013-01-04
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公开(公告)号： US20140077359A1公开(公告)日： 2014-03-20
- 发明人: Pei-Chun Tsai , Yu-Jen Tseng , Tin-Hao Kuo , Chen-Shien Chen
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48
摘要：
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap.
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